Ceramic PCB: Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni), (AL) and others & produce final circuit coating:0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate: The integration of the thin film,thick film,electrode plating and electroless plating processes: Application: 1. High Power LED ceramic substrate 2. Microwave (Wireless Communication & Radar) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6.Flip chip/eutectic substrate .7.Sensor ceramic substrate.
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